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U-Bond Technology WAP
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Name
AB potting machine
▲ Various parameters are adjustable, the amount of adhesive is stable, and no adhesive is leaked;
▲ It can realize fast programming; integrated with adhesive, potting and track potting functions, fully automatic operation;
▲ On-demand ratio, to achieve glue mixing while mixing, to maximize glue savings;
▲ Double barrel designed, adhesive A and adhesive B are stored separately to ensure that the adhesive does not solidify for long time;
▲ The mixing ratio is adjustable from 100:100 to 100:10;
▲ With online three-axis, used as a single machine
▲ Optional rubber mixing, heating and vacuum defoaming function, suitable for different types of glue filling process
Number
Classification
Dispensing Equipment (Semi-Automatic)
Applicable Adhesive
Application Field
Quantity
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Product Description
Product parameters
Technical Parameters:
Ratio accuracy | ±1% |
Exjection accuracy | ±1% |
The mixing ratio | Adjustable from 100:100 to 100:10, using dynamic or static mixing, mixing evenly and fully |
Spitting speed | 60g / min ~ 1440g / min |
Measurement method | Stepper motor + gear pump / rotary plunger pump |
Plastic bucket mixing power | 120W |
Mixing power | 180W |
Heating power | 300-1000W |
Working environment | Humidity: 20-90%, temperature 0-40 °C |
Single barrel size | 30 liters 325 (D) X410 (L) 2 |
Weight | 200KG |
Air pressure | 1-10bar |
Mixing speed | 10-100RPM |
Machine size | L*W*H(1200*700*1200) |
Key words
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Positioning double platform dispenser