▲ Touch screen operation interface, easy to learn and understand;
▲ Various parameters are adjustable, the amount of adhesive is stable, and no adhesive is leaked;
▲ It can realize fast programming; integrated with adhesive, potting and track potting functions, fully automatic operation;
▲ On-demand ratio, to achieve glue mixing while mixing, to maximize glue savings;
▲ Double barrel designed, adhesive A and adhesive B are stored separately to ensure that the adhesive does not solidify for long time;
▲ The mixing ratio is adjustable from 100:100 to 100:10;
▲ With online three-axis, used as a single machine
▲ Optional rubber mixing, heating and vacuum defoaming function, suitable for different types of glue filling process

Number

Classification

Dispensing Equipment (Semi-Automatic)

Applicable Adhesive

Low viscosity two-component Adhesive such as epoxy , PU , and Silicon

Application Field

Semiconductor package、Semiconductor package, PCB parts fixing and protection, LED potting, battery box potting, auto parts potting, hardware parts packing potting, quantitative liquid filling.

Quantity

Ask For Price

Product Description

Product parameters

Technical Parameters:

Ratio accuracy	±1%
Exjection accuracy	±1%
The mixing ratio	Adjustable from 100:100 to 100:10, using dynamic or static mixing, mixing evenly and fully
Spitting speed	60g / min ~ 1440g / min
Measurement method	Stepper motor + gear pump / rotary plunger pump
Plastic bucket mixing power	120W
Mixing power	180W
Heating power	300-1000W
Working environment	Humidity: 20-90%, temperature 0-40 °C
Single barrel size	30 liters 325 (D) X410 (L) 2
Weight	200KG
Air pressure	1-10bar
Mixing speed	10-100RPM
Machine size	LWH(12007001200)

Key words

Positioning double platform dispenser

Group Introduction

Solutions

Products

AB potting machine