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Dongguan U-Bond Material Technology Co., Ltd. (hereinafter referred to as “U-Bond Technology”) was established on September 26,

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U-Bond Technology WAP

Dongguan U-Bond Material Technology Co., Ltd. (hereinafter referred to as “U-Bond Technology”) was established on September 26,

Classification:
Company News
Release time:
2018/11/15 12:01
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[Abstract]:
Dongguan U-Bond Material Technology Co., Ltd. (hereinafter referred to as “U-Bond Technology”) was established on September 26, 2003 with a registered capital of 60 million yuan.

Dongguan U-Bond Material Technology Co., Ltd. (hereinafter referred to as “U-Bond Technology”) was established on September 26, 2003 with a registered capital of 60 million yuan.