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Solder paste product guide
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Refer to the following lead-free
Classification
Solder Paste
Application Field
Packing Specification
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Product Description
Product parameters
Please select the appropriate product according to the specific application and purpose. Halogen free type solder paste is available to each application.
| The Selection of Lead Free Solder Paste | ||||||
| Application | Cleaning Type | Alloy Composition | Melting Point | Recommended | Character | Typical Application |
| SMT Printing | No Clean | Sn96.5Ag3.0Cu0.5 | 217-221 | EUP-148 EUP-148N |
General-Purpose solder paste with high Ag content. | PC Mother board,Router,household appliances. |
| EUP-1000HQR | Outstanding performance of ICT testing. | Server,notebook and desktop computer. | ||||
| EUP-100F | Good wettability for fine pitch to avoid BGA HIP. | Mobile device of smart phone, tablet PC. | ||||
| Sn98.5Ag1.0Cu0.5 | 217-226 | EUP-G48 | General-purpose solder paste with medium Ag content and lower cost. | PC mother board,router,household appliances. | ||
| EUP-300F | Good wettability for fine pitch to avoid BGA HIP. | Mobile device of smart phone, tablet PC. | ||||
| Sn99.0Ag0.3Cu0.7 | 217-227 | EUP-448 | General-purpose solder paste with low Ag content and low cost. | Router, household appliances，LED assembly, solar junction box. | ||
| Sn42Bi58 | 138 | K-236 | Low melting point eutectic Sn-Bi alloy with good anti solder ball property. | Heat sensitive component soldering. Single reflow Through Hole process for assembly of double sided board to eliminate wave soldering. | ||
| Sn42Bi57.6Ag0.4 | 138-143 | D33 | Low temperature,Ag added to improve anti-drop property. Good wettability and anti solder ball properties. | Heat sensitive component soldering. Single reflow Through Hole process for assembly of double sided board to eliminate wave soldering. Substitute of SAC paste as solution of Non Wetting Open (NWO) defective. | ||
| Sn-Bi57-X | 138-142 | DW-1000 | EUNOW's patent pending alloy with dopant added to significantly improve anti-drop property. Good wettability and anti solder ball properties. | |||
| Sn64Bi35Ag1.0 | 138-187 | K-636 | Reducing Bi content and Ag added to improve anti-drop property with higher temperature. Good wettability and anti solder ball properties. | Assembly OF LED. | ||
| Water washable | Sn96.5Ag3.0Cu0.5 | 217-221 | EUP-148W | Outstanding anti slump property, long time stencil life and good wettability. Flux residues are easy to clean using warm water. | For high cleaness by water cleaning. | |
| SMT Dispensing | No Clean | Sn96.5Ag3.0Cu0.5 | 217-221 | U-159 | Outstanding dispensing property. Perfect anti slump and solder ball property with good wettability. | Connector terminal. |
| K-159 | Specially formulated for laser or induction rapid heating soldering with less spattering of flux and solder ball. | For application of rapid heating soldering, such as laser or induction heating. | ||||
| EUP-149 | Specially formulated for Jet Printing Process with good flowability,less clockage of jetting head and perfect solder paste deposit. | Solder paste Jet Printing Process. | ||||
| Heat Sink | No Clean | Sn42Bi58 | 138 | EUP-236 | Good wettability event to Ni coating on Al component with low void leading to perfect heat conducting effect. | Heat sink for high heat components, such and CPU of PC mother board,LED,smart phone and industrial high power components. |
| Water washable | Sn99.0Ag0.3Cu0.7 | 217-227 | EUP-448W | Good wettability event to Ni coating on Al component with low void leading to perfect heat conducting effect. Flux residues are easy to clean using warm water. | Applied for heat sink requiring surface treatment after water washing such as heat sink for smart phones and communication base station,etc. | |
| Semiconductor Packaging Transferring | No Clean | Sn96.5Ag3.0Cu0.5 | 217-221 | EUP-159 | Stable solder paste transferring during working period. Long paste pot life and outstanding solderability. | POP process and LED Die Attach. |
Key words
Low temperature solder paste
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