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U-Bond Technology WAP
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Name
Solder Wire
Number
EUW Series
Classification
Solder Wire
Application Field
Packing Specification
Quantity
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Product Description
Product parameters
Please select the appropriate product according to the specific application and purpose.
| Type | EUW-300 | EUW-821 | EUW-100HF | EUW-600 |
| Cleaning | No-Clean | No-Clean | No-Clean | Water washable |
| Application | General purpose application | High reliability application |
Halogen free Cl<900PPM,Br<900PPM Cl+Br<1500PPM |
Water washable |
| Operation |
Hand soldering Soldering Robot |
Hand soldering Soldering Robot |
Hand soldering Soldering Robot |
Hand soldering Soldering Robot |
| Optional Alloy |
SAC305，SAC105，SAC0307,SnCu0.7，SACX0207 Other lead free alloy |
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| Diamete r(mm) | F0.3-3 | F0.3-3 | F0.3-3 | F0.3-3 |
| Flux Content (Wt%) | 2.5%，3% | 2.5%，3% | 2.5%，3% | 2.5%，3% |
|
Flux Type J-STD-004B |
ROL0 | ROL0 | ROL0 | ORM0 |
|
Halide Content IPC-TM-650 2.3.35 (Wt%) |
<0.05% | 0.00% | 0.00% | 0.00% |
|
Copper Corrosion IPC-TM-650 2.6.15 |
No corrosion | No corrosion | No corrosion | \ |
|
SIR IPC-TM-650 2.6.3.3 |
>1´109 | >1´1010 | >1´109 | \ |
|
Spread JIS Z 3197 |
>75% (SnCu0.7) |
>75% (SnCu0.7) |
>75% (SnCu0.7) |
>75% (SnCu0.7) |
|
Spattering JIS Z 3197 |
Good | Good | Perfect | Good |
| Character | Perfect Wettability | Good wettability and high reliability | Good wettability and perfect spattering properties. |
Ease of solderability. |
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 |
| Hand soldering | manual soldering |
Key words