Low temperature solder paste

DW-1000: No-clean low-temperature lead-free solder paste, based on Eunow low-temperature lead-free patented alloy LTS037 (CN105195915), applied to PC, especially NB SMT assembly. The solder paste reflow peak temperature <200°C,effectively solves the Non Wetting Open (NWO),beacuse of the component and PCB warpage caused by high temperature reflow of SAC solder paste. The Eunow DW-1000 participates in the iNEMI low temperature assembly project test initiated by Intel and performances well in terms of printability, Bi-phase fusion, and IMC thickness stability.

Number

DW-1000

Classification

Solder Paste

Application Field

Heat sensitive component soldering. Single reflow Through Hole process for assembly of double sided board to eliminate wave soldering. Substitute of SAC paste as solution of Non Wetting Open (NWO) defective.

Packing Specification

500g

Quantity

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Product Description

Product parameters

Key words

Solder paste product guide

Solder paste for semiconductor packaging

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Low temperature solder paste