Solder paste for semiconductor packaging

This product is a Sn96.5 Ag3.0 Cu0.5 lead-free solder paste, and specifically designed for the application of POP process.Consistent amount of solder paste transferred during working life.Long working life in solder paste tray.Nitrogen reflow is recommended（O2<1500ppm）

Number

EUP-159

Classification

Solder Paste

Application Field

POP process

Packing Specification

30g

Quantity

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Product Description

Product parameters

Alloy	Sn96.5Ag3.0Cu0.5
Powder type	T5（15-25μm), T6（5-15μm）
Viscosity(Pa.s)	30 (Malcom,2nd 10rpm)
Flux type	ROL0
Flux content(%)	20.0

Key words

Low temperature solder paste

SMT application solder paste

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Solder paste for semiconductor packaging