SMT application solder paste

No-clean SAC305 solder paste, special formulat designed for fine pitch printing.Good wettability for micro-pad, anti BGA head-in-pillow, low void.

Number

EUP-100F

Classification

Application Field

Mobile device of smart phone, tablet PC

Packing Specification

500g

Quantity

Ask For Price

Product Description

Product parameters

1.Good stencil separation property and stable solder paste deposit

2.Improve the heat resistance of flux to maintain high temperature activation

Key words

Solder paste for semiconductor packaging