Search
-
-
-
Solder paste product guide

Copyright © 2018 Dongguan U-Bond Material Technology Co., Ltd. All Rights Reserved

粤ICP备14079568号-1   Powered by www.300.cn

U-Bond Technology WAP

Page view:
Name

Solder paste product guide

The lead-free solder paste developed by EUNOW is mixed of lead-free solder powder with extremely low surface oxidation and flux paste with excellent chemical stability. It has good application, soldering wettability and post-soldering reliability. Please select the appropriate product according to the specific application and purpose. Halogen free type solder paste is available to each application.
Number
Refer to the following lead-free
Classification
Application Field
Electronic SMT assembly, heat sink, automotive electronics, semiconductor packaging, LED assembly, photovoltaic industry.
Packing Specification
500g
Quantity
-
+
没有此类产品
Ask For Price
Product Description
Product parameters

 Please select the appropriate product according to the specific application and purpose. Halogen free type solder paste is available to each application.

 

The Selection of Lead Free Solder Paste
Application Cleaning Type Alloy Composition Melting Point Recommended Character Typical Application
SMT Printing No Clean Sn96.5Ag3.0Cu0.5 217-221 EUP-148
EUP-148N
General-Purpose solder paste with high Ag content. PC Mother board,Router,household appliances.
EUP-1000HQR Outstanding performance of ICT testing. Server,notebook and desktop computer.
EUP-100F Good wettability for fine pitch to avoid BGA HIP. Mobile device of smart phone, tablet PC.
Sn98.5Ag1.0Cu0.5 217-226 EUP-G48 General-purpose solder paste with medium Ag content and lower cost. PC mother board,router,household appliances.
EUP-300F Good wettability for fine pitch to avoid BGA HIP. Mobile device of smart phone, tablet PC.
Sn99.0Ag0.3Cu0.7 217-227 EUP-448 General-purpose solder paste with low Ag content and low cost. Router, household appliances,LED assembly, solar junction box.
Sn42Bi58 138 K-236 Low melting point eutectic Sn-Bi alloy with good anti solder ball property. Heat sensitive component soldering. Single reflow Through Hole process for assembly of double sided board to eliminate wave soldering.
Sn42Bi57.6Ag0.4 138-143 D33 Low temperature,Ag added to improve anti-drop property. Good wettability and anti solder ball properties. Heat sensitive component soldering. Single reflow Through Hole process for assembly of double sided board to eliminate wave soldering. Substitute of SAC paste as solution of Non Wetting Open (NWO) defective.
Sn-Bi57-X 138-142 DW-1000 EUNOW's patent pending alloy with dopant added to significantly improve anti-drop property. Good wettability and anti solder ball properties.
Sn64Bi35Ag1.0 138-187 K-636 Reducing Bi content and Ag added to improve anti-drop property with higher temperature. Good wettability and anti solder ball properties. Assembly OF LED.
Water washable Sn96.5Ag3.0Cu0.5 217-221 EUP-148W Outstanding anti slump property, long time stencil life and good wettability. Flux residues are easy to clean using warm water. For high cleaness by water cleaning.
SMT Dispensing No Clean Sn96.5Ag3.0Cu0.5 217-221 U-159 Outstanding dispensing property. Perfect anti slump and solder ball property with good wettability. Connector terminal.
K-159 Specially formulated for laser or induction rapid heating soldering with less spattering of flux and solder ball. For application of rapid heating soldering, such as laser or induction heating.
EUP-149 Specially formulated for Jet Printing Process with good flowability,less clockage of jetting head and perfect solder paste deposit. Solder paste Jet Printing Process.
Heat Sink No Clean Sn42Bi58 138 EUP-236 Good wettability event to Ni coating on Al component with low void leading to perfect heat conducting effect. Heat sink for high heat components, such and CPU of PC mother board,LED,smart phone and industrial high power components.
Water washable Sn99.0Ag0.3Cu0.7 217-227 EUP-448W Good wettability event to Ni coating on Al component with low void leading to perfect heat conducting effect. Flux residues are easy to clean using warm water. Applied for heat sink requiring surface treatment after water washing such as heat sink for smart phones and communication base station,etc.
Semiconductor Packaging Transferring No Clean Sn96.5Ag3.0Cu0.5 217-221 EUP-159 Stable solder paste transferring during working period. Long paste pot life and outstanding solderability. POP process and LED Die Attach.

 

 

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
Key words
Next article