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Low silver Solder Bar

Low silver Solder Bar (Alloy SACX0207), with better overall performance than SAC305 alloy.
Number
EUB-0207A
Classification
Application Field
Widely used in electronic wave soldering and hot dip tinning process such as tinning of component terminal, cable, solar ribbon, semi-flexible cable, etc.
Packing Specification
1KG/Root 25KG/Box
Quantity
-
+
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Product Description
Product parameters

 

The (Cu,X)6Sn5 IMC layer formed at the interface during the welding process,effectively restrain the diffusion process of Cu, prevents the growth of interface IMC, delays the change- process of solder joint reliability, and increases the life of the product. .
Enhance Anti-creep capability: Since the (Cu,X)6Sn5 IMC layer is slower to heat load than Cu6Sn5, its anti-grain roughening and anti-creep capability: is higher than that of SAC305 alloy.
Enhanced mechanical performance.
Reduce the rate of copper corrosion.
Restrain Solder whisker growth.

 

 

 

 

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暂未实现,敬请期待
暂未实现,敬请期待
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