U-Bond Technology WAP
Low silver Solder Bar
◆ The (Cu，X)6Sn5 IMC layer formed at the interface during the welding process,effectively restrain the diffusion process of Cu, prevents the growth of interface IMC, delays the change- process of solder joint reliability, and increases the life of the product. .
◆ Enhance Anti-creep capability: Since the (Cu，X)6Sn5 IMC layer is slower to heat load than Cu6Sn5, its anti-grain roughening and anti-creep capability: is higher than that of SAC305 alloy.
◆ Enhanced mechanical performance.
◆ Reduce the rate of copper corrosion.
◆ Restrain Solder whisker growth.