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SMT application solder paste

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SMT application solder paste

No-clean SAC305 solder paste, special formulat designed for fine pitch printing.Good wettability for micro-pad, anti BGA head-in-pillow, low void.
Number
EUP-100F
Classification
Application Field
Mobile device of smart phone, tablet PC
Packing Specification
500g
Quantity
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Product Description
Product parameters

 

1.Good stencil separation property and stable solder paste deposit

 

2.Improve the heat resistance of flux to maintain high temperature activation

 

 

 

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
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