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Solder Paste

No-clean solder paste .Good wettability event to Ni coating on Al component with low void leading to perfect heat conducting effect. For heat sink application.
Number
EUP-236
Classification
Application Field
Heat sink for high heat components, such and CPU of PC mother board,LED,smart phone and industrial high power components.
Packing Specification
500g
Quantity
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暂未实现,敬请期待
暂未实现,敬请期待
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