U-Bond Technology WAP
SMT application solder paste
Good performance in ICT testing, anti BGA head-in-pillow.
After reflowed, conventional solder paste will leave too much residue on the surface of ICT testing point, which results in misjudgement. By improving the flow-ability of soldering flux during reflow, EUP-1000HQR leaves nearly no residue on the surface of ICT testing point to reduce rate of misjudgement greatly.