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Name
SMT application solder paste
Good performance in ICT testing, anti BGA head-in-pillow.
Number
EUP-1000HQR
Classification
Solder Paste
Application Field
Packing Specification
Quantity
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Product Description
Product parameters
After reflowed, conventional solder paste will leave too much residue on the surface of ICT testing point, which results in misjudgement. By improving the flow-ability of soldering flux during reflow, EUP-1000HQR leaves nearly no residue on the surface of ICT testing point to reduce rate of misjudgement greatly.
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Solder Paste
low-temperature lead-free solder paste
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