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SMT application solder paste

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SMT application solder paste

No-clean SAC305 solder paste, excellent viscosity storage stability and continuous printing viscosity stability, used in long-term stencil life. Can be stored at room temperature.
Number
EUP-148N
Classification
Application Field
PC Mother board,Router,household appliances.
Packing Specification
500g
Quantity
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Product Description
Product parameters


As a result of chemical reaction of solder powder and flux paste during printing to generate metal salts, the viscosity of conventional solder paste will increase, leading to deterioration in quality. By adding the unique additives to inhibit the reaction between solder powder and flux to a minimum level, EUP-148N has property of long stencil printing life.


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