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Module cleaning agent

Solvent-based cleaning agent.Used for ultrasonic cleaning of fingerprints, dust and other contaminants on the surface of the module.
Number
GC101
Applicable process
Module cleaning
Application Field
Cleaning temperature: 40-60 ℃. Cleaning time: 5-7 mins,cleaning temperature and cleaning time should be adjusted according to the actual cleaning effect. Working concentration: 100 %.
Packaging specification
20L/Barrel
Quantity
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Product Description
Product parameters

 

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