U-Bond Technology WAP
SMTA China East Technical Conference
Leaded by Intel, major industry players participated, and the low-temperature soldering technology workshop sponsored by iNEMI came to an end during NEPCON.
This is also the report of iNEMI's results to the industry. At the conference, participants from Intel, Dell, Flextronics, Huawei, VW, Meidemei Aifa, and Tamura expressed their opinions and discussed in depth the topics of concern to the industry such as reliability.
Chen Qin, the speaker of Ubond, provided low-temperature soldering solutions for the guests. All of them were highly praised and the response was overwhelming! Eunow low temperature lead-free solder paste, a new generation of industrial trends！